High-Performance Cooling Fins | Topology-optimized Design with Anodized Finish for 5G/EV Customization
High-Performance Cooling Fins | Topology-optimized Design with Anodized Finish for 5G/EV Customization
Couldn't load pickup availability
Next-gen Thermal Management
Key Advantages:
Aerodynamic Design: 25°±1° fin angle with 0.8mm pitch, 120% increased effective surface area
Military-grade Craftsmanship**: CNC-machined 6063 Al + Hard Anodizing (25μm, HV≥400)
Extreme Reliability**: 2000 thermal cycles (-40℃~150℃) compliant with MIL-STD-810G
Technical Specifications
| Parameter | Value | Standard |
|---------------------|--------------------------|---------------------|
| Base Material | 6063-T5 Aluminum | ASTM B221 |
| Surface Treatment | Black Hard Anodizing | MIL-A-8625 Type III |
| Thermal Conductivity| 220 W/(m·K) | ASTM E1461 |
| Contact Resistance | ≤0.03℃·cm²/W | SEMI G38-0296 |
Industry Applications
◼ 5G Infrastructure: Chipset cooling modules for 40W/cm² heat flux
◼ EV Systems: IP67-rated OBC thermal solutions
◼ Industrial Automation: Forced air cooling for servo drives
Customization: DFM optimization/EMC coating/Al-Cu hybrid structures




