High-Performance Cooling Fins | Topology-optimized Design with Anodized Finish for 5G/EV Customization

Next-gen Thermal Management  
​Key Advantages:  
Aerodynamic Design: 25°±1° fin angle with 0.8mm pitch, 120% increased effective surface area  
Military-grade Craftsmanship**: CNC-machined 6063 Al + Hard Anodizing (25μm, HV≥400)  
Extreme Reliability**: 2000 thermal cycles (-40℃~150℃) compliant with MIL-STD-810G  

Technical Specifications 
| Parameter           | Value                    | Standard            |  
|---------------------|--------------------------|---------------------|  
| Base Material       | 6063-T5 Aluminum         | ASTM B221           |  
| Surface Treatment   | Black Hard Anodizing     | MIL-A-8625 Type III |  
| Thermal Conductivity| 220 W/(m·K)              | ASTM E1461          |  
| Contact Resistance  | ≤0.03℃·cm²/W            | SEMI G38-0296       |  

Industry Applications
◼ ​5G Infrastructure: Chipset cooling modules for 40W/cm² heat flux  
◼ ​EV Systems: IP67-rated OBC thermal solutions  
◼ ​Industrial Automation: Forced air cooling for servo drives  

Customization: DFM optimization/EMC coating/Al-Cu hybrid structures